: Equalizing temperatures across the entire board and allowing the flux to activate and clean the surfaces.
: Gradually increasing the temperature to avoid thermal shock to the PCB or components. IPC-7530
A compliant thermal profile typically consists of four critical phases: : Equalizing temperatures across the entire board and
: Controlled cooling to determine the grain structure of the solder joint. Guidelines for Effective Profiling IPC-7530 Standard Only | electronics.org IPC-7530
, officially titled Guidelines for Temperature Profiling for Mass Soldering Processes , is the industry standard for creating and managing thermal profiles in electronics manufacturing. It ensures that all solder joints reach the necessary temperatures for metallurgical bonding without damaging heat-sensitive components.
: The stage where the temperature exceeds the solder's liquidus point to form the joint.
